AMS02 Electronics Summary ========================= M. Capell 28 Sept 2000 rev 30 May 2001 This is just the best idea I have at the moment. Corrections/additions/comments welcome (I'm trying). Possible lack of consistency acknowledged. All totals are for flight units - production quantities larger. Updated versions of this file MAY be found at URL=http://ams.cern.ch/AMS/Electronics/Summary.txt Contents * Lists of summaries of Summary - what, where * Thermal breakdown by crate/box (not filled in YET) * More detailed description of each box. * (some) Abbreviations Lists of summaries of Summary - what, where ============================================ Electronics mounted in racks. Q Type Cards DC-DC Dissip Function -- -------- ----- ----- ------ -------- 8 T-crate 20 20 80 W Tracker Readout 2 U-crate 20 20 W TRD Readout 4 S-crate 8 20 W ToF+ACC Readout 4 R-crate 15 20 W RICH Readout 2 E-crate 22 20 W ECal Readout ? G-crate SRD Readout 1 JTRG-crate 10? 5 W Trigger+Timing 1 JMDC-crate 24 40 W DAQ 2 CCDB 6? 60 W Cyrocooler Electronics 1 PDB (not applic) 200 W Power Distribution 4 MCB 4? 3 W Monitor & Control 1 LAB 6? 2 W Laser Alignment 1 UGE 4? 4 W TRD Gas Box (S & C) Electronics 1 TTCE 4? 4 W Tracker Thermal Control Electronics 1 ASTE W Amiga Star Tracker Electronics Electronics of note mounted on the detectors Q Type Location Dissip Function ---- --------- --------- ------ -------- 192 TFES+TKEK Ladder Ends 1 W Tracker Front End, S & K sides. 82 UFE TRD Sides mW TRD Front End 82 UHVD TRD Sides mW TRD HV Distrib. 82 UGMC TRD Top? mW TRD Gas Manifold Control 8 SPE ToF Ends W Scint Peripheral Electronics 96 STPM ToF Ends mW ToF PMTs 32 SAPM VC flange mW ACC PMTs 1056 RPFE RICH Bttm mW RICH PMT+FE 324 EPFE ECal Sides mW ECal PMT+FE Electronics and stuff not mounted in racks, and not on detectors. Q Type Location Dissip Function ---- --------- --------- ------ -------- 1 CAB Below WakeUp W Cyromagnet Avionics Box 1 CVB Below WakeUp W Cyromagnet Valve Actuator n MB various mW B-Field monitors m MT various mW Temp Monitors 1 UGBC Below WakeUp W TRD Gas Box C 1 UGBS Below WakeUp W TRD Gas Box S 1 TTCS Below WakeUp W Tracker Thermal Control System 2 ASTC ?Above RamDown W Amiga Star Tracker Camera The stuff hanging below the WakeUp rack is from port to starboard: UGBC, UGBS, TTCS, CVB, CAB. Note: I'm assuming we don't need any other "thermal" electronics, except the HTRs, see the PDB discussion, below. Rack layout ----------- <-------------LONG RACKS -------------> <-- SHORT RACKS --> Wake Ram Wake Ram Wake Ram Up Down Lower Port T-crate T-crate T-crate T-crate U-crate S-crate S-crate UGE LAB CCDB JMDC R-crate R-crate / center -- MCB MCB MCB MCB E-crate E-crate --- TTCE CCDB PDB JTRG R-crate R-crate \ line S-crate U-crate S-crate ?ASTE T-crate T-crate T-crate T-crate Starboard Here are some features that many boxes (of which crates are a subclass) should have in common: A) One (or two) 28VDC feeds from the PDB (see descrip below). These feeds come into a <> thermostatically driven temperature interlock, which prevents the electronics from being powered if the box is below its operational limit by diverting the power to a foil heater mounted in this box. If the temperature is OK, then power is filtered and supplied (via an unswitched 28->5 DC-DC) to (a) control unit(s), typically a USCM (pair), which then takes care of turning on the rest of the elements depending on defaults and commands. B) Boxes are independently mountable and dismountable (you may need to undo a few cables). C) A box is a unit for which full "space qualification" (T-V-T, EMC, Vibration) makes some sense, Crates, specifically, have two parts: * the card cage (with or without backplane), * the power distribution part (xPD) containing the DC-DC converters Cards are multilayer PCB plus components on each side and come in at least four types: * Stnd. - with 2 VME connectors to the backplane 2*(3x32 contacts on 2.54mm spacing) * cPCI - with "Compact PCI" HM 2mm connectors: "A" + "B22" + "B19" + "A" + "B22" (535 sig.cont.) not all connectors mounted on all boards ? * Free - with no backplane connectors....just flying wire cabling. * xHVR - HV regulator, 2 PCBs with potting in between But they all have the same PCB LxW dimensions (TBC) and same thermal/mechanical interface to the crates ?? Right now we assume the card LxW is the same as AMS 01 and the usual card pitch is 20.32 mm. Right now we assume the xPD's are a flat box which fits between the back of the crate (the side opposite to the one the cards slip into the cage) and the crate radiators (at least for the long racks, for the short racks, which have the radiators on one side, it is understudy) with a thickness of ~70mm, a height of ~300mm (just less than the crate wall) and a variable length depending on how many DC-DC are inside, but not as long as the crate it is supplying. Within this box the heat sinking edge of the DC-DC are all mounted to the cold plate, which contacts the radiators directly. The max DC-DC pitch is about 30mm. See the figure: Crate Crate Wall Wall \ --+-----------------+-- / \ \|| | . . . . . . . . | ||/ \ || |. . . . . .| || | || | . Card . . . | || | || |. . . . . .| || |-- card cage || | . . . . . . . . | || | || |. . . . . . . . .| || | || +-======---======-+ || / || --======---======-- || / <- backplane (if any) |+---------------------+| <- back cover || o-o-o-o-o-o-o-o-o || <- box heater ? || +-----------------+ || \ || | +-----+ +-----+ | || | || | |dc-dc| |dc-dc| | || |-- xPD between crate walls || | +-----+ +-----+ | || | || +-----------------+ || / ~~~~~~~~~~~~~~~~~~~~~~~~~ <- thermal interface ///////////////////////////////// \ \\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\ |- Radiator ///////////////////////////////// / (Note - there is no particular relation between the number of cards and the number of DC-DC converters). Note that the xPD's will also house the RICH and ECal HV Elevators. The connection for the power, moitoring and control lines between the xPD and the crate/backplane is via cables with connectors. Anway, here is my understanding of each crate thermally speaking T-Crate (8) ======= Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 12 TDR2 Stnd 2438 mW = 2*(496+357+366) 4 TPSFE Stnd 1800 mW = 6*1W*(2.6V-2.0V)/2.0V 1 TBS Stnd 450 mW = guess (=3600/8) 1 JINF cPCI 700 mW = ( 600 + 100) 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 20 Total-Cards 40 W TPD --- 20 DC-DC, various p.n., filtering, etc. Total-TPD 36 W = (100W/crate-24Wladder-40WCards) ===== G.Tot T-crate 76 W U-crate (2) ======= Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 6 UDR2 Stnd 366 mW = 1*(366), 2CDP:1H+1C 6 UPSFE Stnd mW = 6 UHVG Stnd mW = 1 JINF cPCI 700 mW = ( 600 + 100) 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 20 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-UPD yy W = ===== G.Tot U-crate zz W S-crate (4) ======= Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 1 SDR2 Free mW = 1*(366), 2CDP:1H+1C 4 SFET Free mW = 1 SFEC Free mW = 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 8 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-SPD yy W = ===== G.Tot S-crate zz W R-crate (4) ======= Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 6 RDR2 Stnd 732 mW = 2*366mW (CDP) 3 RPSFE Stnd = 3 RHVR ? = 1 JINF cPCI 700 mW = ( 600 + 100) 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 15 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-RPD yy W = ===== G.Tot R-crate zz W E-crate (2) ======= Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 6 EDR2 Stnd 366 mW = 1*366mW, 2CDP:1H+1C 6 EPSFE Stnd = 6 EHVR ? = 1 ETRG Stnd = 1 JINF cPCI 700 mW = ( 600 + 100) 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 22 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-EPD yy W = ===== G.Tot E-crate zz W JTRG-crate (1) ========== Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 2 JLV1 Stnd = 2 JTBX Stnd = 4 JINJ Stnd 225 mW = ( 600 + 100 +100 + 100)/4 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 10 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-JTRGPD yy W = ===== G.Tot JTRG zz W JMDC-crate (1) ========== Q Cards Type Dissip (@2KHz) -- ---- ---- ------ 4 JSBC cPCI = 4 JBU cPCI = 4 JIM-AMSW cPCI = 4 JIM-CAN cPCI = 4 JIM-HRDL cPCI = 1 JFOM cPCI? 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 23 Total-Cards xx W nn DC-DC, various p.n., filtering, etc. Total-JMDCPD yy W = ===== G.Tot JMDC zz W TCS (1) === Q Cards Type Dissip -- ---- ---- ------ 2 TCSC Stnd mW 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 4 Total-Cards xx W 4 DC-DC, various p.n., filtering, etc. Total-TCSPD yy W = ===== G.Tot TCS zz W UGE (1) === Q Cards Type Dissip -- ---- ---- ------ 2 UGEC Stnd mW 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 4 Total-Cards xx W 4 DC-DC, various p.n., filtering, etc. Total-UGEPD yy W = ===== G.Tot UGE zz W MCB (4) === Q Cards Type Dissip -- ---- ---- ------ 2 MCE Stnd mW 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 4 Total-Cards xx W 4 DC-DC, various p.n., filtering, etc. Total-MCBPD yy W = ===== G.Tot MCB zz W CCDB (2) ==== Q Cards Type Dissip -- ---- ---- ------ 2 CCxx Stnd mW 2 CCyy Stnd mW 2 USCM Stnd 1050 mW = (2000 + 100)/2 ------- 6 Total-Cards xx W z DC-DC, various p.n., filtering, etc. Total-CCDBPD yy W = ===== G.Tot UGE 60 W LAB (1) === Q Cards Type Dissip -- ---- ---- ------ ------- 6 Total-Cards xx W z DC-DC, various p.n., filtering, etc. Total-LABPD yy W = ===== G.Tot LAB 2 W PDB === Different format but fits in rack... ===== G.Tot PDB 200 W ASTE ==== Different format but fits in rack... ===== G.Tot ASTE z W And here is a description of each of the elements mentioned..... Common Electrical Elements -------------------------- USCM "Universal Slow Control Module" Function: Interface between CAN busses and signal conditioning units which monitor and control various things. Readout of attached strings of DS18S20 digital temperature sensors. Connects: FP: 2xCANbus on one 9pin connector. Temp sensor strings ? BP: various. Contains: Dallas Semicond. micro-controller,.... PowerDis: 2000 mW when (very) active, 100 mW when not active. Tot./Fmt: lots / Stnd. Mounted : In most crates and boxes, in pairs. Note : This supercedes various xPC's in earlier summary. CDP "Common Digitial Part" (of xDR) Function: Block between detector front ends and rest of DAQ, provides memory to store incoming digitized signals, receives commands from DAQ tree, delays LV1 trigger, formats and reduces data,... Connects: all BP: to JINF. Contains: Memory (SRAM), GA (Actel), DSP (ADSP2197L-BKST), LVDS tx/rx PowerDis: 336 mW when processing data at 2Khz, 100 mW when not active. Tot./Fmt: 192 (Tracker) + 24 (TRD) + 48 (RICH) + 12 (ECal) + 8 (S) = 284/ either piggy back or dropped into xDR PCB. JINF "DAQ Interface Node, Front End" Function: Block between xDRs and rest of DAQ, provides memory to store incoming digitized signals, receives commands from DAQ tree, fans out LV1 trigger, fans in HOLD signals, does not analyze data but may reformat. Note : Board holds two functionally identical and independent halves which are known as CDDC's and closely resemble the CDP's. Connects: FP: 4 or 8 AMSWire total. BP: to 24 xDRs, twice. Contains: Memory (SRAM), GA (Actel), DSP (ADSP2197L-BKST), LVDS tx/rx PowerDis: 600 mW per half when processing data at 2Khz, 100 mW per half when not active. 700 mW total, assuming 1H1C. Tot./Fmt: 8 (Tracker) + 2 (TRD) + 4 (RICH) + 2 (ECal) = 16/cPCI T-crate ======= Tracker Numerology: ------------------- TOTAL Tracker FLIGHT Comments Planes 5 Layers 8 1 or 2/plane Ladders 192 <=30/layer Strips 197K 1024/ladder on two sides "S" & "K" TFES 192 1/ladder, 1/2*5 VA, 1/640 signals TFEK 192 1/ladder, 1/ 6 VA, 1/384 signals T-Crate 8 2/rack, 1/24 ladders TDR2 96 12/crate, 1/2 ladders, 1/(2*1024) signals TDR 192 24/crate, 2/TDR2, 1/1 ladder, 1/1024 signals JINF 8 1/crate TPSFE 32 4/crate, 1/3 TDR2, 1/6 ladders TBS 8 1/crate USCM 16 2/crate TPD 8 1/crate, containing 20 DC-DC TBP 8 1/crate Mechanics 8 1/crate, 1/20 cards Descriptions ------------ TDR2 "Tracker Data Reduction Two" Function: Digitization and data reduction of signals from two ladders. Pass through of voltages and timing signals. Note : Board holds two functionally identical and independent halves (which are known as "TDR"'s). Connects: FP: 4 tracker cables from the 2 pairs TFES+TFEK of 2 ladders, BP: for DAQ and T/T to JINT, for power and bias from TFE. Contains: Per half: "S" side: 2 amp+ADC, "K" side: 1 amp+ADC, decouplers, 1 CDP (see elsewhere), baseline is that "sequencer" functionality is included in the not so "CDP" (so one GA total). PowerDis: (peak), (noact), (10%), to T-crate Side Wall (SW). Tot./Fmt: 96 (1 per 2 ladders = 12 each in 8 T-crates) / Stnd. Mounted : In T-crate, from front. TPSFE "Tracker Power Supply: Front End" Function: Controls individual voltages required for 3*TDR2's, 6*(TFES+TFEK)'s and 6 ladders, including those voltages referenced to bias. Connects: all via BP to 3*TDR2, from TPD, from TBS, from USCM. Contains: Control and monitoring electonics including 6 LV linear regulators (LR) referenced to gnd and 6 LV LR to Bias. PowerDis: 1800 mW to SW Tot./Fmt: 32 = 4 (1 for 6 ladders) in each of 8 crates / Stnd. Mounted : from front of T-crate. TBS "Tracker Bias Supply" Function: Controls bias voltages which deplete the silicon ladders. Connects: BP to TDR2 ("K" side) via TPSFE, from TPD. Contains: Control and monitoring electronics, including 4 medium-voltage (60 to 120V) LR 1/group, 24 return bias ("-2V") lines. PowerDis: ???? mW to SW Tot./Fmt: 8 = 1 in each of 8 crates / Stnd. Mounted : from front of T-crate. TPD "Tracker Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to TBP, monitoring and control signals to USCMs. Contains: DC-DC Converters - about 20 - plus diode OR's and filters. List of DC-DC's (total of 16, where are the other 4?) 1*2 for "UPS" for USCM & +12V trick. 1*2 for Bias (to be increased ?) 1*4 for Digital (maybe 2*2 ?) 4 for K-ADC's and VA's 4 for S-ADC's and VA's PowerDis: 36 W to BW Tot./Fmt: 8 = 1 in each of 8 crates / Special TBP "Tracker Backplane" Function: Connects the 20 cards together and the power supply. U-crate ======= TRD Numerology: --------------- TOTAL TRD FLIGHT Comments Layers 20 Towers 82 Modules 328 4/tower, 16 to 18/layer Wires 5248 16/module UFE 82 1/tower, 1/2 VA, 1/64 signals=chan UHVD 82 1/tower UGMC 82 2/2towers U-Crate 2 1/rack, 1/40 or 42 towers UDR 12 6/crate(*1H1C), 1/7 towers, 1/448 chan JINF 4 2/crate(=1H1C), 1/6 UDR, 1/12 UDR + 2 SDR slaves UPSFE 12 6/crate, 2/4 UDR, 2/14 towers UHVG 12 6/crate, 1/7 towers USCM 4 2/crate UPD 2 1/crate UBP 2 1/crate Mechanics 2 1/crate, 1/20 Cards UGE 1 UGBS 1 UGBC 1 Descriptions ------------ UDR2 "TRD Data Reduction Two" As TDR2 except: each card receives the digitized input from 7 towers, the two halves of each card run 1H1C on this input. PowerDis: mW to SW UPSFE "TRD Power Supply: Front End" As TPSFE except: Function: Each half (7 LV LR) feeds from 1 DC-DC to 14 UFE, Which are also fed, via OR, from another UPSFE. The two halves of each UPSFE distribute Ana (VA) and Dig (ADC) Voltages. Contains: Control and monitoring electonics including 2 sets of 7 LV LR referenced to gnd PowerDis: mW to SW UHVG "TRD HV Generator" Function: C-W Generation of HV from intermediate voltage for wires in one tower. Connects: FP: HV Cable to tower. BP: Control signals from USCM. Contains: 2 sets of 7 C-W generators each with LRS control chip from intermediate voltage (+ 120VDC ?). PowerDis: TBD. Tot./Fmt: 12 / Stnd. Mounted : In U crate. Note : This has moved off TRD detector into the U crate. UPD "TRD Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to UBP, monitoring and control signals to USCMs. Contains: DC-DC Converters - about 32 - plus diode OR's and filters. List of DC-DC's: 1*2 for "UPS" for USCM & +12V trick (TBC). 6*2 for HV (120VDC) 2*2 for Digital (maybe 2*2 ?) 6*1 for VA's 6*1 for ADC's PowerDis: W to BW Tot./Fmt: 2 = 1 in each of 2 crates / Special S-crate ======= ToF+ACC Numerology ------------------ ToF: Layers 4 Paddles 48 12/layer PMTs 192 1 pair/paddle-end ACC: Paddles 16 PMTs 32 1/paddle-end S-Crate 4 1/rack, 1/(24 ToF + 8 ACC) paddle-ends 1/(24 PMT pairs+ 8 PMTs) SFET 16 4/crate, 1/8 paddle ends. SFEC 4 1/crate, 1/32 (64?) charge measurements. SDR2 4 1/crate (=1/2H1/2C), USCM 4 1/crate SPD 4 1/crate Mechanics 4 1/crate, 1/8 Cards Descriptions: ------------- Note Guido intends that this crate has no backplane, all cabling is done by flying wires in the backplane region. Furthermore he intends the electronics to have full hot-cold redundancy and no cross strapping ? And requests 2 28VDC feeds from the PDB per crate..... SFET "Scintillator Front End: Time of Flight" Function: Discriminated analog signal to trigger, "History" TDC Signal, "40:1 Time-Stretcher" TDC Signal for 8 paddle ends (either a ToF PMT pair or an ACC PMT). Note : This card has two sides run 1H1C. Connects: FP signal sum-A connections from 8 ToF PMT-pairs. BP for DAQ to SDR, power from SPD, tbd: trigger out (fast & L1), timing-in Contains: 2 TDCs (8ch each) for time-history, time-stretcher PowerDis: to SW Tot./Fmt: 16 cards = 4 in 4 crates / Free format. Mounted : from front of S-crate. Note : The ACC PMT's are treated exactly like a ToF PMT pair. There is no more "SFEA". SFEC "Scintillator Front End: Charge" Function: Digitization of dynode? pulse height of 24 PMT pairs sum-D's plus 8 ACC PMT dynodes. Output to trigger for Z>N flag ? Note : This card has two sides run 1H1C. The function of this card may be incorporated in SDR, SPE, or SFET. Connects: FP signal-D connections to 24 PMT Box pairs (24 ends) + 8 ACC. Contains: VA(>32ch) or other front end ASICs from RICH,ECal, ADC. PowerDis: to SW Tot./Fmt: 4 = 1 in 4 crates / Free format. Mounted : from front of S-crate. SDR2 "Scintllator Data Reduction Two" As TDR2 except: Data is TDC output from SFET's as well as ADC from SFEC. 2 halves are run 1H1C. Note : TBD. There are not two identical halves per card, rather there are two (1H1C) identical modules per crate. Connects: BP DAQ from 4*SFET and 1*SFEC: ADC & TDC; FP DAQ to JINJ, T/T PowerDis: to SW Tot./Fmt: 4 cards = 1:1/2H1/2C in 4 crates / Free format. Mounted : from front of S-crate. Note: The HV Elevators are in the SPD, the HV is regulated in the SPE. SPD "Scint Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to S-crate electronics, monitoring and control signals to USCMs. Contains: DC-DC Converters - about ?? - plus diode OR's and filters. List of DC-DC's 1*2 for "UPS" for USCM & +12V trick (TBC). n*2 HV elevators (2600 VDC?) n*2 for Digital (maybe 2*2 ?) n*1 other low voltage. PowerDis: W to BW Tot./Fmt: 4 = 1 in each of 4 crates / Special R-crate ======= RICH Numerology --------------- Detector PMTs 1056 Pixel 16896 4x4/PMT Strings 192 1/(5 or 6 PMT),48/crate R-crate RPFE 1056 1/PMT, 1/16 signals, 1/32 channels (dual gain) (5 or 6)/string RDR2 24 6/crate RDR 48 2/RDR2, 1/4 strings, 1/22 PMT RPSFE 12 3/crate, 1/4RDR, 1/16 strings, 1/88PMT RHVR 12 3/crate, 1/4RDR, 1/16 strings, 1/88PMT RBP 4 1/crate Mechanics 4 1/crate, 1/15 Cards Note: The HV Elevators are in the RPD, the HV is regulated in the RHVR. Descriptions: ------------- RDR2 "RICH Data Reduction Two" As TDR2 except: each card half (RDR) receives the digitized input from 4 strings. The two halfs are both running/ PowerDis: mW to SW RPSFE "RICH Power Supply: Front End" As TPSFE except: Function: Controls individual voltages (+3.6)&(+3.6,-2.6VDC) required passed through RDR's for RPFEs Contains: Control and monitoring electonics including 24 LV linear regulators (LR) referenced to gnd Tot./Fmt: 12 = 3 each in 4 crates/ Special - thick. PowerDis: mW to SW RHVR "RICH HV Regulator" Function: HV regulation for each of 16 strings. Connects: FP: HV Cable to string. BP?: HV cable from RPD. Contains: HV LR potted between two PCBs. PowerDis: TBD. Tot./Fmt: 12 = 3 each in 4 crates/ Special - thick. Mounted : In R crate. RPD "RICH Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to RBP or directly to RICH boards, monitoring and control signals to USCMs. Contains: DC-DC Converters - about 20 - plus diode OR's and filters. List of DC-DC's (total of 16, where are the other 4?) 1*2 for "UPS" for USCM & +12V trick (TBC). 3*2 HV Elevators (800V) 3*2 for Digital (3.3V) ?? (do these need lin reg ?). 3*2 for ASICs (+3.0,-2.0) PowerDis: W to BW Tot./Fmt: 4 = 1 in each of 4 crates / Special E-crate ======= ECal Numerology --------------- Detector superlayers 9 sides 4 4 or 5 superlayers readout/side PMTs 324 36/s'layer, 18/s'layer/side, 72 or 90/side Pixels 1296 4/PMT E-Crate EPFE 324 1/PMT, 1/9 signals (Dual Gain + Dynode) EDR2 12 6/crate(*1/2H1/2C), 1/27 PMT EPSFE 12 6/crate, 1/27PMT EHVR 12 6/crate, 1/27PMT ETRG 2 1/crate, 1/162 PMT EBP 2 1/crate Mechanics 2 1/crate, 1/22 Cards Descriptions: ------------- EDR2 "ECal Data Reduction Two" As UDR2 except: connects to 27 EPFE EPSFE AS RPSFE - details hazy. EHVR As RHVR - details hazy. ETRG "ECal Trigger" Function: Form partial ECal trigger. Connects: ? Contains: GA PowerDis: TBD. Tot./Fmt: 2 / Stnd. Mounted : In E crate. EPD "ECAL Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to RBP or directly to RICH boards, monitoring and control signals to USCMs. Contains: DC-DC Converters - about 20 - plus diode OR's and filters. List of DC-DC's (total of 16, where are the other 4?) 1*2 for "UPS" for USCM & +12V trick (TBC). ?*2 HV Elevators (800V) ?*2 for Digital (3.3V) ?? (do these need lin reg ?). ?*2 for ASICs (+3.0,-2.0) PowerDis: W to BW Tot./Fmt: 2 = 1 in each of 2 crates / Special SRD === This would fit in the general scheme, details pending. I'd guess these would slot in next to the upper S-crates. JTRG crate ========== Trigger Numerology ------------------ Hold Signals from/LV1 signals to: 8*2 JINF in T-crate 2*2 JINF in U-crate 4*2 SDR2 in S-crate 4*2 JINF in R-crate 2*2 JINF in E-crate 1*2 ??? in LAB 2*2 "external inputs", including LAB ? ---- 23*2 signals Hold/LV1, plus of course the "hold" from LV1 itself.... FT trigger inputs: 8*2 from S-crate (one per plane end). LV1 inputs: from each S-crate: 24 hits from ToF, 8 hits from ACC. 24 Z>? from ToF. from each E-crate: 162 PMT hits or ?? From ETRG. We may, to get the synchronization right, need to interface this somehow to the star tracker electronics (ASTE). Descriptions: ------------- This is very much still at conceptual stage and is just a place holder for DAQ electronics that is not in the JMDC crate. This serves as the fast trigger, level-1 trigger, hold processing and as a home for the top level CDDC's (JINJ). The level-1 trigger is also a front end DAQ slave node. For reference here is my table of AMSWire nodes: Tracker --TDR- -RICH- --EMC- -Scint A) # sub detec crates 8 2 4 2 4 (total = 20 (20)) B) # CDP/crate (c&h) 24 6&6 12 6&6 1&1 C) # CDP tot (A*B) 192 24 48 24 8 (total = 296 (284)) D) # CDP tot hot 192 12 48 12 4 (total= 268 (262)) E) # ADC/CDP 3 7 22 27 note: 1 lad 1 mod F) # digitization/ADC 1 384 64 32 9 +2 320 G) # digitization/CDP (E*F) 1024 448 704 243 H) ADC MSPS max 5 1 1 1 eg: All ADC's in ||: I) Min digit'n time(us) (F*H) 76.8 64 32 9 J) Max data->CDP(Mhz) (E*H) 15 7 22 27 K) Min Time for data->CDP(ns) 67 142 45! 37! eg: ADC's read at H) in series & ||, such that I<=76.8: K) ADC series*|| 1*3 1*7 2*11 6*4.5 L) data->CDP(MHz) 15 7 11 4.5 M) data->CDP(ns) 67 142 91 222 N) Time to digitize(us) 76.8 64 64 27 And here is my (not yet commonly agreed upon) AMSWire "network": DAQ Front End nodes: TDR(Tracker) - 192 nodes = 24 in 8 T-crates. UDR(TRD) - 24 nodes = 6 hot (6 cold) in 2 U-crates. SDR(ToF+ACC) - 8 nodes = 1 hot (1 cold) in 4 S-crates. RDR(RICH) - 48 nodes = 12 in 4 R-crates. EDR(ECAL) - 24 nodes = 6 hot (6 cold) in 2 E-Crates. JLV1 - 2 nodes = 1H1C Except for the JTRG, each supports two masters. Except for SDR and JLV1, these are the JINF located in the same crate. The SDRs and JLV1s plug directly into the JINJs. The intermediate DAQ layer is formed by JINF's: 16 nodes = 2 in 8 T-crates, 24 Hot TDR Slaves each, 4 nodes = 2 in 2 U-crates, 12 (6H6C) UDR Slaves, 8 nodes = 2 in 4 R-crates, 12 Hot RDR Slaves, 4 nodes = 2 in 2 E-crates, 12 (6H6C) EDR Slaves each of these supports two masters as well (MY SCHEME), plus 8 nodes = 2 in 4 S-crates (the SDR slaves 1H1C) and 2 nodes = 2 in 1 JTRG crate (the JLV1 slave, 1H1C). The top level DAQ layer is formed by the 4 JINJ, each JINJ connects to 1 or the other JINF in 8 T-crates 2 U-crates 4 R-crates 2 E-crates as well as to 1 or the other SDR in 4 S-crates as well as to BOTH JLV1 in 2*1 JTRG-crate For a total of 22 Slaves. And each of the four JINJ connects to each of the JMDC (16 links total) and the JMDC are also interconnected by AMSWire links (3+2+1=6 links). Anyway... JMDC Crate ========== Numerology ---------- TOTAL FLIGHT Comments JMDC Crate 1 JMDC 4 Consists of the following five cards - JSBC 4 1/JMDC, 1 CPU, northbridge, main memory, etc. JBU 4 1/JMDC, two 1GB banks JIM-CAN 4 1/JMDC, supports 2 CAB bus interface JIM-AMSW 4 1/JMDC, supports 8 AMSWire links JIM-HRDL 4 1/JMDC, supports 2 HRDL links and one RS422. JFOM 1 includes two HRDL halves plus RS422 half. USCM 2 JMDCBP 1 for 4*5+1+2=23 cards JMDCPD 1 Mechanics 1 Descriptions: ------------- JMDC "Main DAQ Computer" Function: This is composed of ~5 cards, listed below, with a common (compact)PCI bus between them. This bus does NOT connect the different JMDC's. Tot./Fmt: 4 (1H3C)/5*cPCI cards JMDC/JSBC "DAQ Single Board Computer" Function: central processor unit, cPCI master, see Lebedev's talks. Connects: to cPCI bus Contains: single board computer w/PPC750, "north"bridge (CPC700), PROM, flash, local memory. PowerDis: (active) W, (idle) W Tot./Fmt: 4 = 1 in 4 JMDCs/cPCI Mounted : From front of J-crate. JMDC/JBU "DAQ memory BUffer" Function: Large memory buffer, equivalent to 2hrs of output data, to store data when waiting for HRDL to ACOP, Ku, ... Connects: to cPCI bus Contains: 2* 1GB memory banks PowerDis: (active) W, (idle) W Tot./Fmt: 4 = 1 in 4 JMDCs/cPCI Mounted : From front of J-crate. JMDC/JIM-CAN "DAQ Interface Module to CAN busses" Function: CAN interface to/from JMDC. Connects: to cPCI bus, 2*CAN Bus Contains: cPCI interface GA, I have to check the rest. PowerDis: (active) W, (idle) W Tot./Fmt: 4 = 1 in 4 JMDCs/cPCI Mounted : From front of J-crate. JMDC/JIM-AMSW "DAQ Interface Module to AMSWire" Function: AMSWire interface(s) to/from JMDC Connects: to cPCI bus, 8 AMSWire links (4 to JINJ, 3 to other JMDC, 1 spare) Contains: cPCI interface +AMSWire GA(s), LVDS Tx/Rx PowerDis: (active) W, (idle) W Tot./Fmt: 4 = 1 in 4 JMDCs/cPCI Mounted : From front of J-crate. JMDC/JIM-HRDL "DAQ Interface Module to HRDL (and RS422)" Function: HRDL and RS422 interface(s) to/from JMDC Connects: to cPCI bus, 1*RS422 Tx,Rx link and 2*(pre-)HRDL copper links (Tx,Rx) to JFOM. Contains: cPCI interface + RS422 and HRDL GA(s), Cypress Chips ? PowerDis: (active) W, (idle) W Tot./Fmt: 4 = 1 in 4 JMDCs/cPCI Mounted : From front of J-crate. JFOM "RS422 & Dual Taxi F/O Driver/Receiver" Function: Seperately for each of the 3 links (RS422 and 2*HRDL=Taxi F/O) this connects, via a simple "OR", the 4 JMDC/JIM-HRDL Tx's into the appropriate Tx (with some low (bit/byte stream) level modification as required by the links ?) and, conversely, it just fan's out the Rx from those links to each of the JMDC/JIM-HRDL Rx's. Note : This consists of three independent "halves" mounted on one board. Connects: Each of 3 halves to 4 JMDC/JIM-HRDL Tx,Rx plus link Tx,Rx Contains: As little as possible. PowerDis: c. 4 W ?? Tot./Fmt: 1./cPCI or Stnd. Mounted : From front of J-crate. Note : There is an ongoing discussion to make this an "ORU" (Orbital Replaceable Unit), however we might as well just fly more of these if we anticipate it could fail. JMDCPD "JMDC Power Distributor" Function: Converts and filters the 28VDC to "usable" voltages. Connects: 28VDC input from PDB, various voltage output to JMDC and JFOM. monitoring and control signals to USCMs. Contains: DC-DC Converters - about ?? - plus diode OR's. List of DC-DC's (total of 16, where are the other 4?) 1*2 for "UPS" for USCM & +12V trick (TBC). This is all to be worked out. PowerDis: W to BW Tot./Fmt: 1 = 1 in each of 1 crates / Special Note : The 28VDC feed(s) to the JMDCPD have to be enabled by default (in case the "MCC" or LRDL breaks). Magnet Electronics ------------------ (Note This is included the just for completeness, except for the CCDB's it is not rack mounted). CyroMagnet Connects: Bus bar leads to CAB, various sensors, valve control lines. Contains: 2 main or dipole coils and 8 or is it 10 ? smaller "racetrack" flux return coils made of SC NbSn clad in 6N pure Al. PowerDis: nil. under normal ops. Tot./Fmt: 1. / the coils form sort of a toroid. Mounted : Inside of the toroidal vacuum case, inside of the He tank. The cold tips from 4 cyrocoolers penetrate the vessel. CAB "Cryomagnet Avionics Box" Function: The box contains most all of the electronics for the magnet that is outside of the magnet. Administratively it also contains the dump diodes and the precision shunt, even those are mounted elsewhere. Connects: For power to the PDB: 124VDC, 28VDC. For C&D link via CAN bus to MCC, various control and sensor lines to other magnet stuff and the magnet bus bars. It is not connected to the cyrocoolers or their electronics. Contains: CCSC, CCS, CSP, Power Switches. PowerDis: maybe 20W nominal, upto 450W during magnet charging. to base plate, to TBD. Tot./Fmt: 1 / Box Mounted : On wake side below upper rack (starboard end). CCSC "Cryomagnet Controller and Signal Conditioner" Function: Control and monitoring of the magnet (except Quench detection). Connects: Other units inside and outside the CAB Contains: Signal conditioners, uControllers, "normal" DC-DC convertors. In fact the controller and signal conditioning blocks are doubled up and cross strapped - so it is better than 1H1C redundant. PowerDis: to CAB baseplate. Tot./Fmt: 2 (1H1C) / several PCBs connected by mother board. Mounted : Inside CAB. CCS "Cryomagnet Current Source" Function: Drive current into magnet during magnet charing operations. Connects: 124VDC main feed via PDB, magnet bus bars Contains: 6 DC-DC convertors (can work with 5) to drive 455A into magnet (48H) with varying output voltage. PowerDis: to CAB baseplate. Tot./Fmt: 1 / several PCBs connected by mother board. Mounted : Inside CAB. CSP "Cryomagnet Self Protection" Function: Detect begining of magnet quench and initiate discharge through quench heaters to smoothly quench all the coils. In addition, there is a dead man timer plus backup battery such that after a progammable number of hours, if there is no communication from "AMS", the magnet will automagically smoothly ramp down. Connects: to quench monitors, quench battery, power switches, etc. Contains: PowerDis: to CAB baseplate. Tot./Fmt: 1 / several PCBs connected by mother board. Mounted : Inside CAB. Precision Shunt Function: Monitor current being run into magnet during charging ops. Connects: to "live" magnet bus bar, monitoring pickoffs. Contains: Metal Bar. PowerDis: TBD. Tot./Fmt: 1 / unknown. Mounted : on USS, forms section of magnet bus bar. Dump Diodes Function: Dissipate magnet current during discharge ops. Connects: to magnet. Contains: 6 or 7 triplets of high power rectifiers. PowerDis: large but infrequent. Tot./Fmt: 3 or 4 triplets per USS joint ? Mounted : on USS joints near wake trunnions. Quench Capacitor (part of the CSP really). Function: Store and discharge sufficient energy (2*256J) to quench magnet smoothly in a short time (50ms). Connects: to CPS, magnet coil quench heaters, trickle charger. Contains: PowerDis: TBD. Tot./Fmt: 2 / unknown. Mounted : TBD. Backup Battery (part of the CSP really). Function: Store and discharge sufficient energy (TBD) to power CSP during power outage, and to ramp down after "a while" if not told not to. Connects: to CPS, trickle charger. Contains: PowerDis: TBD. Tot./Fmt: 2 / unknown. Mounted : TBD. CVA "Cyrovalve Activator" Note : There is a box somewhere with He that is used to drive the cyrovalves. Don't forget about it. I don't know if it has electronics inside or not. IN FACT WE STILL DON'T KNOW IF THE VALVES ARE PNEUMATIC OR NOT. Cryocoolers Function: Remove heat from some parts of the magnet (outer vapor cooled shield, straps, ...) Connects: to magnet, to CCDB. Contains: Linear Sterling Engine with He gas piston (Sunpower M87). PowerDis: 100+8 W nominal. If one of 4 fails the others will be cranked up to 150+12 W. Heat available on collar. Tot./Fmt: 4/special. Mounted : on magnet rim, precise locations TBD. CCDB "Cryocooler Control & Drive Box" Function: Monitor, control and provide voltage (90VAC@60Hz) to Cryocoolers. Connects: to 124VDC, 28VDC (TBD), CAN bus, Cyrocoolers. Contains: 2 USCMs (1H1C) plus two driver subunits which use class "D" amplifier to provide 100W input (nominal). PowerDis: 62W nominal (assuming 70% effic, plus 2W for USCM) Tot./Fmt: 2/ 1 for two cyrocoolers. Mounted : in racks "near" to cyrocoolers. *************************************************************************** WARNING: Information below is at best speculative. <<<<<<<<<<<<<<<<<<<<<<< *************************************************************************** PDB "Power Distribution Box" Function: Convert 124VDC to 28VDC for other subsystems and control and monitor its distribution. Note that, except for the MCC's, I'm betting that nothing else needs the unswitched power supply bus shown on ealier sketches. Also distributes 124VDC as need, see "Connects:" Connects: to 124VDC (MAIN, AUX) ISS busses, 2xCAN bus, 28 VDC feeds (all in racks except CAB) to: 1*8 T-crates/TPD 1*2 U-crates/UPD 2*4 S-crates/SPD 1*4 R-crates/RPD 1*2 E-crates/EPD 1*1 JTRG-crate/JTRGPD 1*1 JMDC-crate/JMDCPD >>DEFAULT ON !<< 1*1 TTCE 1*1 UGE 1*4 MCB 1*4 CCDB 1*1 LAB 1*1 ASTE 2*1 CAB --- 40 total 28VDC feeds at the moment. 124 VDC feeds to: 1 CAB (ISS MAIN only - unswitched) ?10 HTR (ISS MAIN only - switched?, default on) ?10 HTR (ISS AUX only - switched?, default on) 2 CCDB (ISS MAIN+AUX - switched?) Note: The system level heaters (HTR) are foils mounted on the backs of radiators with simple temperature interlocks (see box discussion, above). The supply of the CCDB is very TBD. Contains: Control electronics (USCMs?) with dedicated, unswitched? internal DC-DC converters. Two sides (for MAIN, AUX). Each side with (a set of) 1600 W 124 to 28VDC DC-DC, plus 40 Solid State Power Controllers (SSPCs). The outputs of the corresponding SSPC on each side are OR'd to produce the 28VDC feed. PowerDis: 160W (assume 90% effic) + 10W for contollers. Tot./Fmt: 1/box Mounted : in wake down rack TBD. Monitor & Control Electronics ----------------------------- Summary of CAN Nodes and CAN bussing. In AMS 2 we are planning, for each slave node, two CAN bus connections (as opposed to AMS 1, where each had three). Typically, each slave-node has an independent "brother" node that can provide the same functionality. For example, a particular power switch can be acted on by either of the two "brother" nodes. However, the number of CAN busses that are connecting these busses is not yet fixed (In AMS 1 we had three busses). In AMS 2 we'll probably have at least four, such that each pair of brothers can be adressed with greater independence. Anyway, a crtical point is that all bus stubs must be accessible. If you have two brothers in your "box" you must bring all four stubs out to connectors. OK ? Here is the summary of the known CAN slaves with location. Possible redundant "brothering" indicated by "(*2)". Functions should be clear from above/below. Whether the USCMs have on board 28-5 DC-DC or there is a pair in the xPD is still TBD. Note some forseen nodes have been suppressed/subsumed/swallowed. CAN Slave Node list: Number Location Type 8(*2) 1pr/T-crate USCM 2(*2) 1pr/U-crate USCM 4(*2) 1pr/S-crate USCM 4(*2) 1pr/R-crate USCM 2(*2) 1pr/E-crate USCM 1(*2) 1pr/JTRG-crate USCM 1(*2) 1pr/JMDC-crate USCM 4(*1) 1 /JIM-CAN USCM 1(*2) 1pr/TTCE USCM 1(*2) 1pr/UGE USCM 4(*2) 1pr/MCB USCM 2(*2) 1pr/CCDB USCM 1(*2) 1pr/LAB USCM 1(*2) 1pr/CAB special 1(*2) 1pr/PDB USCM which works out to 90 slaves, of which 88 are USCMs. Of course somewhere I should include the MCC's, but this is in flux. MCB "Monitor & Control Boxes" Function: Monitor & control of stuff(T,B,...) Connects: to 28VDC, CAN bus, sensors Contains: Monitor & Control boards ("MCEx", USCM based), plus a pair of USCMs. PowerDis: 12W each to rack cooling. Tot./Fmt: 4/ box (they may be different). Mounted : 1 per (long) rack. Note : I'm assuming these will take care of the following "stray" tasks, perhaps they could also subsume some of the other little boxes... * interface to ASTE star tracker electonics (TBD). * readout of the "global" temperature sensors. * * LAB "Laser Alignment Box" --------------------------- Function: Laser Alignment of tracker. Note : Wolfgang has a pretty good description of what is required, but it is lost in my "inbox". Connects: to 28VDC, CAN bus, JTRG, DAQ Tree ? Contains: Monitor & Control boards (USCM based), LED drivers. PowerDis: TBD to rack cooling. Tot./Fmt: 1/ box, about 5 cards. Mounted : guessing ram up rack. UGE "TRD Gas Electronics" -------------------------- Function: Control and monitoring of TRD Gas boxes S and C, and maybe of the manifolds as well. Note : There exists a preliminary description of this somewhere. Connects: to 28VDC, CAN bus, UGBS(Box S), UGBC(Box C) Contains: Monitor & Control boards (USCM based), Signal Conditioning. PowerDis: TBD to rack cooling. Tot./Fmt: 1/ box, about 5 cards. Mounted : wake up rack near UGBx. TTCS "Tracker Thermal Control Electronics" ------------------------------------------ Function: Control and monitoring of Tracker Thermal Control System. Note : There exists a preliminary description of this somewhere. Connects: to 28VDC, CAN bus, tracker cooling loop elements Contains: Monitor & Control boards (USCM based), Signal Conditioning. PowerDis: TBD to rack cooling. Tot./Fmt: 1/ box, about 5 cards. Mounted : wake up rack near TTCS. ASTE "Amiga Star Tracker Electronics" ------------------------------------- Function: Care and feeding of the two star tracker cameras (ASTC). Note : There exists a description of this somewhere. Connects: to 28VDC, to JTRG ?, RS422 ?? via MCB to CAN. Contains: PowerDis: TBD to rack cooling. Tot./Fmt: 1/ box, about 5 cards. Mounted : ram down rack near ASTCs. Abbreviations: ===================== 1H1C : "One hot, one cold" (also 1HnC) 1553B : Mil-Std-1553 B ACC : AntiCoincidence (or Veto) Counters ACOP : AMS Crew Operations Post ADC : Analog to Digitial Converter (also A/D) AMS : Alpha Magnetic Spectrometer ASTC : Amiga Star Tracker Camera ASTE : Amiga Star Tracker Electronics ASIC : Application Specific Integrated Circuit B/H : Bulkhead BP : Backplane C : Initial for Cryomagnet related objects. C & D : Command and Data CAB : Cyromagnet Avionics Box CAN : Controller Area Network CCD : Charge Coupled Device CCDB : Cryocooler Control & Drive Box CCS : Cryomagnet Current Source CCSC : Cryomag Controller and Signal Conditioner CSP : Cryomagnet Self Protection CVA : CryoValve Activator DAC : Digitial to Analog Converter DAQ : Data Acquisition DSP : Digitial Signal Processor E : Initial for ECal related objects. ECal : Electromagnetic Calorimeter (occasionally EMC) EDR : ECal Data Reduction EPFE : ECal PMT & Front End EHVR : ECal HV Regulator EMC : Electromagnetic Calorimeter (normally ECal) EMC : Electromagnetic Compatability EMI : Electromagnetic Interference EPD : ECal Power Distributor F/O : Fiber Optic FP : Front Panel FPGA : Field Programmable Gate Array Fmt. : Format GA : Gate Array HRDL : High Rate Data Link HV : High Voltage ISS : International Space Station J : Initial for Trigger and DAQ related J422 : RS422 Mulitplexer (obsolete, subsumed into JFOM) JBP : J-crate backplane JBU : JMDC BUffer JET : ECal Trigger processor, if any. JFOM : Fiber optic Multiplexer JIM : JMDC Interface Module (-CAN, -AMSWire, -HRDL) JINx : DAQ Intermediate node, type "x", F=front end, J=top JMDC : Master DAQ Computer JMTT : Master Trigger/Timing, if any JTRGPD : JMDCPD : JSBC : JMDC Single Board Computer JTRG : Main Trigger LAB : Laser Alignment Box LRDL : Low Rate Data Link M : Initial for Monitoring & Control stuff M&C : Monitor and Control MCB : Monitor & Control Box MCC : Monitor & Control Computer MCSx : Monitor & Control Sensor electronics, type "x" MEM : Memory OTL : Out to lunch P : Initial for Power related objects. PAS : Payload Attachment System PCA : Printed Circuit Assembly PCB : Printed Circuit Board PDB : Power Distribution Box PMT : Photo Multiplier Tube POCC : (our) Payload Operations and Control Center R : Initial for RICH related objects. RDR : RICH Data Reduction RPFE : RICH PMT & Front End RHVR : RICH HV Regulator RICH : Ring Imaging CHerenkov detector RPD : RICH Power Distributor RPSFE : Rich Power Supply Front End regulators RT : 1553B Remote Terminal S : Initial for Scintillator related objects. SBP : Scintillator BackPlane (not foreseen). SDR : Scintillator Data Reduction SFEC : Scintillator Front End, Charge measurement SFET : Scintillator Front End: Timing measurement SPF : Single Point Failure SPD : Scintillator Power Distributor STS : Space Transport System (the Shuttle) SW : Side Wall T : Initial for tracker related objects. T/T : Trigger and Timing TBP : Tracker BackPlane TBS : Tracker Bias Supply TDC : Time to Digitial Converter TDR : Tracker Data Reduction TDRS : Tracking and Data Relay Satellite TFEx : Tracker Front End, type "x" TPD : Tracker Power Distributer TPSFE : Tracker Power Supply, Front End TRD : Transition Radiation Detector (initial "U") ToF : Tome of Flight Tot. : Total U : Initial for TRD related objects. UBP : TRD BackPlane UDR : TRD Data Reduction UFE : TRD Front End UGBC : TRD Gas Box "C" (Control) UGBS : TRD Gas Box "S" (Supply) UHVG : TRD HV Generator UMA : Umbilical Mechanical Attachment UPD : TRD Power Distributer UPSFE : TRD Power Supply, Front End USCM : Universal Slow Control Module ZFT : Zero Fault Tolerant